TY  - BOOK
AU  - Pham,Anh-Vu H.
AU  - Chen,Morgan J.
AU  - Aihara,Kunia
TI  - LCP for microwave packages and modules
T2  - The Cambridge RF and microwave engineering series
SN  - 9781107003781  (hardback)
PY  - 2012///
CY  - Cambridge
PB  - Cambridge University Press
KW  - Microwave devices
KW  - Materials
KW  - Microelectronic packaging
KW  - Liquid crystal devices
KW  - Polymer liquid crystals
N1  - Includes bibliographical references and index; Machine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability
ER  -