TY  - BOOK
AU  - Chen,Andrea
AU  - Lo,Randy
TI  - Semiconductor packaging: materials interaction and reliability 
SN  - 9781439862056
PY  - 2012///
CY  - Boca Raton, FL
PB  - CRC Press
KW  - Microelectronic packaging
N1  - Includes bibliographical references and index
ER  -