Materials, integration and packaging issues for high-frequency devices :  symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. / 
editors, P. Muralt ... [et al.] 
 - Warrendale, PA :  Materials Research Society,  2004 
 - xiii, 232 p. :  ill. ;  24 cm. 
 - Materials Research Society symposium proceedings ;  v. 783 .
 - Materials Research Society symposia proceedings ;  v. 783 .
<br/><br/>Includes bibliographical references and indexes 
<br/><br/><label>ISBN: </label>9781558997219 1558997210 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronic packaging--Materials--Congresses