00835nam a2200205 a 4500001001400000003000700014005001700021008004100038020001800079020001500097040000800112245017800120260005600298300003500354490006300389504005200452650004800504700001500552830006200567vtls000062029KUKTEM20251125093712.0120615t2004    paudao f      001 0 eng d  a9781558997219  a1558997210  aUMP00aMaterials, integration and packaging issues for high-frequency devices :bsymposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. /ceditors, P. Muralt ... [et al.]  aWarrendale, PA :bMaterials Research Society,c2004  axiii, 232 p. :bill. ;c24 cm.1 aMaterials Research Society symposium proceedings ;vv. 783  aIncludes bibliographical references and indexes 0aElectronic packagingxMaterialsvCongresses1 aMuralt, P. 0aMaterials Research Society symposia proceedings ;vv. 783