TY  - BOOK
AU  - Muralt,P.
TI  - Materials, integration and packaging issues for high-frequency devices: symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. 
T2  - Materials Research Society symposium proceedings
SN  - 9781558997219
PY  - 2004///
CY  - Warrendale, PA
PB  - Materials Research Society
KW  - Electronic packaging
KW  - Materials
KW  - Congresses
N1  - Includes bibliographical references and indexes
ER  -