TY  - BOOK
AU  - Lin,Qinghuang
ED  - Symposium B, "Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics"
TI  - Materials, processes, integration and reliability in advanced interconnects for micro- and nanoelectronics: symposium held April 10-12, 2007, San Francisco, California, U.S.A. 
T2  - Materials Research Society symposium proceedings
SN  - 9781558999503
PY  - 2007///
CY  - Warrendale, PA
PB  - Materials Research Society
KW  - Interconnects (Integrated circuit technology)
KW  - Congresses
KW  - Integrated circuits
KW  - Very large scale integration
KW  - Microelectronics
KW  - Nanoelectronics
KW  - Materials
N1  - Includes bibliographical references and indexes
ER  -