TY  - BOOK
AU  - Baklanov,Mikhail R.
ED  - Symposium O, "Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics"
TI  - Materials, processes, and reliability for advanced interconnects for micro- and nanoelectronics--2011: symposium held April 25-29, 2011, San Francisco, California, U.S.A. 
T2  - Materials Research Society symposium proceedings
SN  - 9781605113128
PY  - 2012///
CY  - New York
PB  - Cambridge University Press
KW  - Interconnects (Integrated circuit technology)
KW  - Very large scale integration
KW  - Congressesv Congresses
KW  - Microelectronics
KW  - Congresses
KW  - Nanoelectronics
KW  - Materials
N1  - Includes bibliographical references and indexes
ER  -