Handbook of wafer bonding / 
edited by Peter Ramm, James Jian-Qiang Lu, Maaike M.V. Taklo 
 - Weinheim :  Wiley-VCH,  2012 
 - xxxi, 395 p. :  ill. (some col.) ;  25 cm. 
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9783527326464 (hbk.) 3527326464 (hbk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Semiconductor wafers--Handbooks, manuals, etc.<br/>Semiconductors--Bonding--Handbooks, manuals, etc.