TY  - BOOK
AU  - Ramm,Peter
AU  - Lu,James Jian-Qiang
AU  - Taklo,Maaike M.V.
TI  - Handbook of wafer bonding
SN  - 9783527326464 (hbk.)
PY  - 2012///
CY  - Weinheim
PB  - Wiley-VCH
KW  - Semiconductor wafers
KW  - Handbooks, manuals, etc
KW  - Semiconductors
KW  - Bonding
N1  - Includes bibliographical references and index
ER  -