Jiang, Guosheng <br/><br/>
Advanced thermal management materials / 
Guosheng Jiang, Liyong Diao, Ken Kuang 
 - New York, NY :  Springer,  2013 
 - xi, 154 p. :  ill. ;  24 cm. 
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9781461419624 (hbk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Microelectronic packaging--Materials--Thermal properties<br/>Microelectronics--Cooling<br/>Heat sinks (Electronics)