00705nam a2200217 a 4500001001400000003000700014005001700021008004100038020002500079040000800104100002000112245008400132260003600216300003300252504005000285650006100335650003000396650002900426700001700455700001500472vtls000073882KUKTEM20251125095312.0130816t2013    nyua   f      001 0 eng d  a9781461419624 (hbk.)  aUMP1 aJiang, Guosheng10aAdvanced thermal management materials /cGuosheng Jiang, Liyong Diao, Ken Kuang  aNew York, NY :bSpringer,c2013  axi, 154 p. :bill. ;c24 cm.  aIncludes bibliographical references and index 0aMicroelectronic packagingxMaterialsxThermal properties 0aMicroelectronicsxCooling 0aHeat sinks (Electronics)1 aDiao, Liyong1 aKuang, Ken