TY  - BOOK
AU  - Jiang,Guosheng
AU  - Diao,Liyong
AU  - Kuang,Ken
TI  - Advanced thermal management materials
SN  - 9781461419624 (hbk.)
PY  - 2013///
CY  - New York, NY
PB  - Springer
KW  - Microelectronic packaging
KW  - Materials
KW  - Thermal properties
KW  - Microelectronics
KW  - Cooling
KW  - Heat sinks (Electronics)
N1  - Includes bibliographical references and index
ER  -