Copper wire bonding / 
Preeti S. Chauhan... [et al.]. 
 - New York (NY) :  Springer,  2014 
 - xxvi, 235 p. :  ill. ;  c 24 cm. 
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9781461457602 (hbk.) 1461457602 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Structural control (Engineering)<br/>Optical materials<br/>Copper wire