TY  - BOOK
AU  - Chauhan,Preeti S.
TI  - Copper wire bonding
SN  - 9781461457602 (hbk.)
PY  - 2014///
CY  - New York (NY)
PB  - Springer
KW  - Structural control (Engineering)
KW  - Optical materials
KW  - Copper wire
N1  - Includes bibliographical references and index
ER  -