TY  - BOOK
AU  - Nabhan Ismil
TI  - Effect of heat treatment temperature on SN-0.7CU solders material on microstructure
SN  - THE0005856(Local)
PY  - 2007///
CY  - Kuantan, Pahang
PB  - UMP
KW  - Solder and soldering
KW  - Microstructure
N1  - Project paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2007
ER  -