Thermal conductivity 31 :  thermal expansion 19 : joint conferences, June 26-30, 2011, Saguenay, Quebec, Canada : conference host, Universite du Quebec a Chicoutimi, Quebec, Canada / 
 Thermal conductivity thirty-one  Thermal expansion 19  Thermal expansion nineteen  Proceedings of the Thirty-first International Thermal Conductivity Conference  Proceedings of the Nineteenth International Thermal Expansion Symposium 
Laszlo I. Kiss, conference chair, editor of proceedings, [and] Lyne St-Georges, conference co-chair 
 - Lancaster, Pennsylvania :  DEStech Publications, Inc.,  [2013] 
 - xv, 326 p. :  ill. ;  24 cm. 
<br/><br/>Includes bibliographical references and index 
<br/><br/><label>ISBN: </label>9781605950556 1605950556 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Heat--Conduction--Congresses<br/>Heat--Conduction--Measurement--Methodology--Congresses<br/>Materials--Thermal properties--Congresses<br/>Materials--Thermal properties--Measurement--Methodology--Congresses<br/>Expansion (Heat)--Congresses<br/>Expansion (Heat)--Measurement--Methodology--Congresses