Noia, Brandon <br/><br/>
Design-for-test and test optimization techniques for TSV- based 3D stacked ICs / 
Brandon Noia, Krishnendu Chakrabarty ; foreword by Vishwani Agrawal 
 - Cham :  Springer,  2014 
 - xviii, 247 p.) :  ill. (some col.) ;  24 cm. 
<br/><br/>Includes bibliographical references 
<br/><br/><label>ISBN: </label>9783319023779 (hbk.) 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Three-dimensional integrated circuits--Design and construction<br/>Three-dimensional integrated circuits--Testing