TY  - BOOK
AU  - Noia,Brandon
AU  - Agrawal,Vishwani D.
AU  - Chakrabarty,Krishnendu
TI  - Design-for-test and test optimization techniques for TSV- based 3D stacked ICs
SN  - 9783319023779 (hbk.)
PY  - 2014///
CY  - Cham
PB  - Springer
KW  - Three-dimensional integrated circuits
KW  - Design and construction
KW  - Testing
N1  - Includes bibliographical references
ER  -