TY  - BOOK
AU  - Li,Suny
TI  - SiP-system in package design and simulation: Mentor EE Flow Advanced Design Guide 
SN  - 9781119045939
PY  - 2017///
CY  - Hoboken, NJ
PB  - Publishing House of Electronics Industry/Wiley
KW  - Integrated circuits
KW  - Design and construction
KW  - Multichip modules (Microelectronics)
N1  - Includes bibliographical references and index
ER  -