@book{93603,
	author = {Lau, John H., and Lee, Ning-Cheng,},
	title = {Assembly and reliability of lead-free solder joints /},
	publisher = {Springer Singapore :},
	year = {2020},
	address = {Singapore :},
	edition = {1st ed. 2020.},
	url = {https://link-springer-com.libraryumpsa.idm.oclc.org/book/10.1007/978-981-15-3920-6}
}
