Lau, John H., <br/><br/>
Assembly and reliability of lead-free solder joints / 
by John H. Lau, Ning-Cheng Lee 
 - 1st ed. 2020. 
 - 1 online resource 
<br/><br/><label>ISBN: </label>9789811539206 
<br/><br/><label>Subjects--Topical Terms: </label><br/>Electronics<br/>Microelectronics<br/>Electronic circuits