TY  - BOOK
AU  - Lau,John H.
AU  - Lee,Ning-Cheng
TI  - Assembly and reliability of lead-free solder joints
SN  - 9789811539206
PY  - 2020///
CY  - Singapore
PB  - Springer Singapore, Imprint: Springer
KW  - Electronics
KW  - Microelectronics
KW  - Electronic circuits
UR  - https://link-springer-com.libraryumpsa.idm.oclc.org/book/10.1007/978-981-15-3920-6
UR  - https://link.springer.com/book/10.1007/978-981-15-3920-6
ER  -