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  <titleInfo>
    <title>Microstructural evaluation of sn3.0ag0.5cu solder alloy fabricated via powder metallurgy method</title>
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  <name type="personal">
    <namePart>Nadhrah Murad</namePart>
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    <dateIssued encoding="marc">2021</dateIssued>
    <issuance>monographic</issuance>
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  <language>
    <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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  <physicalDescription>
    <extent>xiii, 116 pages : illustrations (some color) ; 30 cm. + 1 CD ROM</extent>
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  <abstract>For decades, casting has been the most influential industrial manufacturing process to  fabricate  and  promote  higher  properties  of  solder  alloy.  However,  stirring  technique  which is commonly applies in casting method has brought some attentions for further  discussions. According to literatures, the stir casting technique has showed quality issue  towards solder alloy property of elementary particles distribution. Thus, concerning the  issue, a green technology known as Powder Metallurgy(PM) method is selected due to  its material processing function which can  also offer particle distribution deals.  It is  basically having two basic procedures which are milling and compacting. These works  for better solder alloy production where it only uses room temperature to consolidate  different  materials  at  once.  Moreover,  a  clean  and  safer  working  environment  is  in  practice and it takes one mould to produce dozens of products which is a big cost saving.  This  study  is  conducted  to  seek  out  the  gap  found  in  the  literature  reviews  on  the  homogeneity issue of the solder alloy’s elemental distributions.  Thus, this research is  carried  out  to  study  the  properties  of  Sn3.0Ag0.5Cu  solder  alloy  prepared  by  PM  method. The selection of materials involving size and shape of the raw materials are  important  factors  whilst  practising  PM  method  due  to  the  end  up  result  of  milling.  Therefore, four different milling durations listing 2, 4, 6 and 8 hours which became the  variables to reach off a homogenize granulated mixture inside the alloy. These mixtures  were  then  compacted  with  a  hydraulic  press  machine  for  1,  3,  5,  7  and  9  ton  of  compaction loads. This step is to ensure the mixture will be in handable form to move  on into reflow test procedure as well as the microhardness test. Through the reflow test,  there are four major topics to be discussed on including the behaviour of solder pallet  by reflow test, wettability test, formation of IMC and the thickness of IMC. All samples  are  cooled  down  by  the  slow  cooling  process.   Results  showed  that  there  is  high  possibility to utilize PM method in solder alloy fabrication due to high distribution of  different  elements  after  milling  process  as  being  confirmed  by  the  SEM  and  EDX  analyses, high  degree of wettability by all samples which lined below 90°.  The SEM  and EDX also displayed scallop IMC of Cu6Sn5  existed at the solder joint and matrix. The IMC thickness depicted quite high values due to longer cooling time. In conclusion,  PM method is a  better option of solder alloy fabrication to practice Green Technology  plus fits the low-cost production and safer environment. The produced solder alloy by  this method also fits the excellent solder alloy properties.</abstract>
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  <note type="statement of responsibility">Nadhrah Murad</note>
  <note>Faculty of Mechanical and Automotive Engineering Technology</note>
  <note>Thesis (Master of Science) -- Universiti Malaysia Pahang – 2021</note>
  <note>Includes bibliographical references</note>
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      <namePart>Faculty of Mechanical and Automotive Engineering Technology</namePart>
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    <topic>Dissertations</topic>
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    <topic>Universities and colleges</topic>
    <topic>Dissertations</topic>
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    <topic>Theses</topic>
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  <identifier type="isbn">THE0009167(Local)</identifier>
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    <recordCreationDate encoding="marc">220315</recordCreationDate>
    <recordChangeDate encoding="iso8601">20251125110001.0</recordChangeDate>
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      <languageTerm authority="iso639-2b" type="code">eng</languageTerm>
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