<?xml version="1.0" encoding="utf-8" ?> <rss version="2.0" xmlns:opensearch="http://a9.com/-/spec/opensearch/1.1/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom"> <channel> <title> <![CDATA[ Search for 'Provider:Kaplan AEC Education,']]> </title> <link> https://efind.ump.edu.my/cgi-bin/koha/opac-search.pl?q=ccl=Provider%3AKaplan%20AEC%20Education%2C&#38;sort_by=title_dsc&#38;format=rss </link> <atom:link rel="self" type="application/rss+xml" href="https://efind.ump.edu.my/cgi-bin/koha/opac-search.pl?q=ccl=Provider%3AKaplan%20AEC%20Education%2C&#38;sort_by=title_dsc&#38;format=rss"/> <description> <![CDATA[ Search results for 'Provider:Kaplan AEC Education,' at ]]> </description> <opensearch:totalResults>12</opensearch:totalResults> <opensearch:startIndex>0</opensearch:startIndex> <opensearch:itemsPerPage>30</opensearch:itemsPerPage> <atom:link rel="search" type="application/opensearchdescription+xml" href="https://efind.ump.edu.my/cgi-bin/koha/opac-search.pl?q=ccl=Provider%3AKaplan%20AEC%20Education%2C&#38;sort_by=title_dsc&#38;format=opensearchdescription"/> <opensearch:Query role="request" searchTerms="q%3Dccl%3DProvider%253AKaplan%2520AEC%2520Education%252C" startPage="" /> <item> <title> Thermodynamics exam file / </title> <dc:identifier>ISBN:1419504193</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=29496</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419504193.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Chicago : Kaplan AEC Education, 2004 .<br /> 250 p. : 28 cm..<br /> 1419504193 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=29496">Place hold on <em>Thermodynamics exam file /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=29496</guid> </item> <item> <title> Statics exam file / </title> <dc:identifier>ISBN:1419504274</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31238</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419504274.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Chicago : Kaplan AEC Education, 2004 .<br /> 346 p. : 28 cm..<br /> 1419504274 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=31238">Place hold on <em>Statics exam file /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31238</guid> </item> <item> <title> Mechanics of materials exam file / </title> <dc:identifier>ISBN:1419504266</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31237</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419504266.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Chicago : Kaplan AEC Education, 2004 .<br /> 378 p. : 28 cm..<br /> 1419504266 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=31237">Place hold on <em>Mechanics of materials exam file /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31237</guid> </item> <item> <title> Mechanical engineering : problems &amp; solutions / </title> <dc:identifier>ISBN:1419501224</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31239</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419501224.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Pefley, Richard K..<br /> Chicago : Kaplan AEC Education, 2004 .<br /> 298, 65 p. : 28 cm..<br /> 1419501224 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=31239">Place hold on <em>Mechanical engineering :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31239</guid> </item> <item> <title> Mechanical engineering / </title> <dc:identifier>ISBN:1419506129</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31240</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419506129.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Hamelink, Jerry H..<br /> Chicago : Kaplan AEC Education, 2005 .<br /> 299 p. : 28 cm..<br /> 1419506129 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=31240">Place hold on <em>Mechanical engineering /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31240</guid> </item> <item> <title> Mechanical engineering : license review / </title> <dc:identifier>ISBN:1419501348</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=55595</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419501348.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Constance, John D..<br /> Chicago : Kaplan AEC Education, 2004 .<br /> 595 p. : 28 cm..<br /> 1419501348 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=55595">Place hold on <em>Mechanical engineering :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=55595</guid> </item> <item> <title> Materials science exam file / </title> <dc:identifier>ISBN:1419504215</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31236</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419504215.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Chicago : Kaplan AEC Education, 2004 .<br /> 314 p. : 28 cm..<br /> 1419504215 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=31236">Place hold on <em>Materials science exam file /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31236</guid> </item> <item> <title> Industrial engineering / </title> <dc:identifier>ISBN:1419504967</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31241</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419504967.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Young, Donovan.<br /> Chicago : Kaplan AEC Education, 2005 .<br /> 127 p. : 28 cm..<br /> 1419504967 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=31241">Place hold on <em>Industrial engineering /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=31241</guid> </item> <item> <title> Electrical engineering : a programmed review / </title> <dc:identifier>ISBN:1419501275</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=40977</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419501275.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Bentley, James H..<br /> Chicago, IL : Kaplan AEC Education, 2004 .<br /> 238 p. : 28 cm..<br /> 1419501275 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=40977">Place hold on <em>Electrical engineering :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=40977</guid> </item> <item> <title> Electrical engineering : problems &amp; solutions / </title> <dc:identifier>ISBN:1419501305</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=40978</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419501305.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Jones, Lincoln D..<br /> Chicago, IL : Kaplan AEC Education, 2004 .<br /> 1v. (various pagings) : 28 cm..<br /> 1419501305 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=40978">Place hold on <em>Electrical engineering :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=40978</guid> </item> <item> <title> Electrical &amp; computer engineering / </title> <dc:identifier>ISBN:1419501305</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=40979</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419501305.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Graham, Edward D..<br /> Chicago, IL : Kaplan AEC Education, 2005 .<br /> 157 p. : 28 cm..<br /> 1419501305 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=40979">Place hold on <em>Electrical &amp; computer engineering /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=40979</guid> </item> <item> <title> Circuit analysis : exam file / </title> <dc:identifier>ISBN:1419504150</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=39471</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1419504150.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Chicago, IL : Kaplan AEC Education, 2004 .<br /> v, 314 p. ; 27 cm..<br /> 1419504150 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=39471">Place hold on <em>Circuit analysis :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=39471</guid> </item> </channel> </rss>
