<?xml version="1.0" encoding="utf-8" ?> <rss version="2.0" xmlns:opensearch="http://a9.com/-/spec/opensearch/1.1/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:atom="http://www.w3.org/2005/Atom"> <channel> <title> <![CDATA[ Search for 'su:&quot;Microelectronics&quot;']]> </title> <link> https://efind.ump.edu.my/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Microelectronics%22&#38;sort_by=title_dsc&#38;format=rss </link> <atom:link rel="self" type="application/rss+xml" href="https://efind.ump.edu.my/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Microelectronics%22&#38;sort_by=title_dsc&#38;format=rss"/> <description> <![CDATA[ Search results for 'su:&quot;Microelectronics&quot;' at ]]> </description> <opensearch:totalResults>99</opensearch:totalResults> <opensearch:startIndex>0</opensearch:startIndex> <opensearch:itemsPerPage>30</opensearch:itemsPerPage> <atom:link rel="search" type="application/opensearchdescription+xml" href="https://efind.ump.edu.my/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Microelectronics%22&#38;sort_by=title_dsc&#38;format=opensearchdescription"/> <opensearch:Query role="request" searchTerms="q%3Dccl%3Dsu%253A%2522Microelectronics%2522" startPage="" /> <item> <title> Vacuum electronics : components and devices / </title> <dc:identifier>ISBN:3540719288 (hbk.) | 9783540719281 (hbk.)</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=39778</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/3540719288.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Berlin : Springer, 2008 .<br /> xvii, 535 p. : 24 cm..<br /> 3540719288 (hbk.) | 9783540719281 (hbk.) </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=39778">Place hold on <em>Vacuum electronics :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=39778</guid> </item> <item> <title> Understanding microelectronics : a top-down approach / </title> <dc:identifier>ISBN:9780470745557</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=63974</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/047074555X.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Maloberti, Franco.<br /> Chichester, West Sussex, U.K. : Wiley, 2012 .<br /> xxiii, 670 p. : , Includes index 26 cm..<br /> 9780470745557 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=63974">Place hold on <em>Understanding microelectronics :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=63974</guid> </item> <item> <title> Thermoelectrics handbook : macro to nano / </title> <dc:identifier>ISBN:0849322642</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=30957</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0849322642.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Boca Raton : CRC/Taylor &amp; Francis, 2006 .<br /> (various pagings). : 27 cm.<br /> 0849322642 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=30957">Place hold on <em>Thermoelectrics handbook :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=30957</guid> </item> <item> <title> System-on-chip : next generation electronics / </title> <dc:identifier>ISBN:0863415520</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=30061</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0863415520.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> London : Institution of Electrical Engineers, 2006 .<br /> 911 p. : 24 cm.<br /> 0863415520 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=30061">Place hold on <em>System-on-chip :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=30061</guid> </item> <item> <title> System-in-package RF design and applications / </title> <dc:identifier>ISBN:158053905x | 9781580539050</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=53509</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/158053905X.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Gaynor, Michael P..<br /> Boston : Artech House, 2007 .<br /> xiii, 221 p. : 24 cm..<br /> 158053905x | 9781580539050 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=53509">Place hold on <em>System-in-package RF design and applications /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=53509</guid> </item> <item> <title> Switching power supply design / </title> <dc:identifier>ISBN:0070522367 | 978070522367</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=27492</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0070522367.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Pressman, Abraham I..<br /> New York : McGraw-Hill, 1998 .<br /> xviii, 682 p. : 24 cm..<br /> 0070522367 | 978070522367 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=27492">Place hold on <em>Switching power supply design /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=27492</guid> </item> <item> <title> Switching power supply design / </title> <dc:identifier>ISBN:9780071482721 | 0071482725</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=49980</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0071482725.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Pressman, Abraham I..<br /> New York : McGraw-Hill, 2009 .<br /> xxxvii, 841 p. : 24 cm..<br /> 9780071482721 | 0071482725 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=49980">Place hold on <em>Switching power supply design /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=49980</guid> </item> <item> <title> Surfaces, interfaces, and thin films for microelectronics / </title> <dc:identifier>ISBN:0470174471 (cloth) | 9780470174470 (cloth)</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=42511</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0470174471.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Irene, Eugene A..<br /> Hoboken, N.J. : Wiley-Interscience, 2008 .<br /> xiii, 515 p. : 25 cm..<br /> 0470174471 (cloth) | 9780470174470 (cloth) </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=42511">Place hold on <em>Surfaces, interfaces, and thin films for microelectronics /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=42511</guid> </item> <item> <title> Sputtering materials for VLSI and thin film devices / </title> <dc:identifier>ISBN:9780815515937</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=64262</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0815515936.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Sarkar, Jaydeep.<br /> Norwich, N.Y. : William Andrew, 2014 .<br /> x, 603 p. : 24 cm..<br /> 9780815515937 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=64262">Place hold on <em>Sputtering materials for VLSI and thin film devices /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=64262</guid> </item> <item> <title> Smart sensors and systems : technology advancement and application demonstrations / </title> <dc:identifier>ISBN:9783030422349</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=93705</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/3030422348.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Cham : Springer International Publishing : | Imprint: Springer, 2020 .<br /> 1 online resource 9783030422349 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=93705">Place hold on <em>Smart sensors and systems :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=93705</guid> </item> <item> <title> SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide / </title> <dc:identifier>ISBN:9781119045939</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=87321</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1119045932.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Li, Suny,.<br /> Hoboken, NJ : Publishing House of Electronics Industry/Wiley, 2017 .<br /> xvii, 477 pages : 25 cm..<br /> 9781119045939 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=87321">Place hold on <em>SiP-system in package design and simulation :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=87321</guid> </item> <item> <title> Silicon Earth : introduction to the microelectronics and nanotechnology revolution / </title> <dc:identifier>ISBN:9780521705059 | 0521705053 | 9780521879392 | 0521879396</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=29277</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0521705053.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Cressler, John D..<br /> New York, NY : Cambridge University Press, 2009 .<br /> xvi, 491 p., [16] p. of plates : 26 cm..<br /> 9780521705059 | 0521705053 | 9780521879392 | 0521879396 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=29277">Place hold on <em>Silicon Earth :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=29277</guid> </item> <item> <title> Sensors and microsystems : proceedings of the 13th Italian conference : Roma, Italy, 19-21 February 2008 / </title> <dc:identifier>ISBN:9789812835970 | 9812835970</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=47333</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9812835970.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> New Jersey : World Scientific , 2009 .<br /> xix, 544 p. : 24 cm..<br /> 9789812835970 | 9812835970 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=47333">Place hold on <em>Sensors and microsystems :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=47333</guid> </item> <item> <title> PSpice for basic microelectronics / </title> <dc:identifier>ISBN:9780073529479 (hard copy : alk. paper) | 0073529478 (hard copy : alk. paper) | 9780073263205 | 0073263206</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=53880</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0073529478.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Tront, Joseph G..<br /> Boston : McGraw-Hill Higher Education, 2008 .<br /> v, 185 p. : 24 cm. +.<br /> 9780073529479 (hard copy : alk. paper) | 0073529478 (hard copy : alk. paper) | 9780073263205 | 0073263206 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=53880">Place hold on <em>PSpice for basic microelectronics /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=53880</guid> </item> <item> <title> Proceedings of the 10th Italian Conference, Sensors and Microsystems, Firenze, Italy, 15-17 February 2005 / </title> <dc:identifier>ISBN:9789812833525 | 9812833528</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=51605</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9812833528.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> New Jersey : World Scientific , 2008 .<br /> xxii, 674 p. : 24 cm..<br /> 9789812833525 | 9812833528 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=51605">Place hold on <em>Proceedings of the 10th Italian Conference, Sensors and Microsystems, Firenze, Italy, 15-17 February 2005 /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=51605</guid> </item> <item> <title> Proceedings of 2018 international conference on optoelectronics and measurement / \ </title> <dc:identifier>ISBN:9789811385957</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=93873</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9811385955.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Singapore : Springer Singapore : | Imprint: Springer, 2020 .<br /> 1 online resource 9789811385957 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=93873">Place hold on <em>Proceedings of 2018 international conference on optoelectronics and measurement / \</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=93873</guid> </item> <item> <title> Power microelectronics : device and process technologies / </title> <dc:identifier>ISBN:9789812791009 | 9812791000</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=49730</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9812791000.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Liang, Yung C..<br /> Singapore : World Scientific , 2009 .<br /> 413 p. : 24 cm..<br /> 9789812791009 | 9812791000 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=49730">Place hold on <em>Power microelectronics :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=49730</guid> </item> <item> <title> Power microelectronics : device and process technologies / </title> <dc:identifier>ISBN:9789813200241</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=89178</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/9813200243.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Liang, Yung C.,.<br /> Hackensack, NJ : World Scientific, 2017 .<br /> xvi, 591 pages : 23 cm..<br /> 9789813200241 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=89178">Place hold on <em>Power microelectronics :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=89178</guid> </item> <item> <title> PIC microcontrollers : an introduction to microelectronics / </title> <dc:identifier>ISBN:0750662670</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26157</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0750662670.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Bates, Martin.<br /> Burlington, MA: Newnes, 2004 .<br /> xiv, 372 p.: , Includes index 25 cm..<br /> 0750662670 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=26157">Place hold on <em>PIC microcontrollers :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26157</guid> </item> <item> <title> PIC in practice : a project-based approach / </title> <dc:identifier>ISBN:0750668261</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26121</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0750668261.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Smith, D. W..<br /> Amsterdam: Newnes, 2006 .<br /> viii, 308 p.: , Includes index 24 cm..<br /> 0750668261 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=26121">Place hold on <em>PIC in practice :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26121</guid> </item> <item> <title> PIC basic : programming and projects / </title> <dc:identifier>ISBN:0750652292</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26095</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0750652292.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Ibrahim, Dogan.<br /> Oxford, UK: Newnes, 2001 .<br /> x, 210 p.: , Includes index 24 cm.<br /> 0750652292 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=26095">Place hold on <em>PIC basic :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26095</guid> </item> <item> <title> PIC : your personal introductory course / </title> <dc:identifier>ISBN:0750650389</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26092</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0750650389.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Morton, John.<br /> Oxford, UK: Newnes, 2001 .<br /> ix, 270 p.: , Includes index 22 cm.<br /> 0750650389 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=26092">Place hold on <em>PIC :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=26092</guid> </item> <item> <title> Photopolymers : photoresist materials, processes, and applications / </title> <dc:identifier>ISBN:9781466517288 (hbk.)</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=82172</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/146651728X.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> By Nakamura, Kenichiro.<br /> Boca Raton, FL : CRC Press, 2015 .<br /> ix, 179 p. : 24 cm..<br /> 9781466517288 (hbk.) </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=82172">Place hold on <em>Photopolymers :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=82172</guid> </item> <item> <title> Novel advances in microsystems technologies and their applications / </title> <dc:identifier>ISBN:9781466560666 (hbk.)</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=81748</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1466560665.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Boca Raton : CRC Press, 2014 .<br /> xix, 613 p. : 24 cm..<br /> 9781466560666 (hbk.) </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=81748">Place hold on <em>Novel advances in microsystems technologies and their applications /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=81748</guid> </item> <item> <title> Nanotechnology and microelectronics : global diffusion, economics and policy / </title> <dc:identifier>ISBN:9781616920067 | 1616920068</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=235</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1616920068.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Hershey, PA : Information Science Reference, 2010 .<br /> xxix, 507 p. : , &quot;Premier reference source&quot; 29 cm..<br /> 9781616920067 | 1616920068 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=235">Place hold on <em>Nanotechnology and microelectronics :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=235</guid> </item> <item> <title> Nanotech Conference &amp; Expo 2010 : technical proceedings of the 2010 NSTI Nanotechnology Conference and Expo : June 21-24, 2010, Anaheim, California, U.S.A. / </title> <dc:identifier>ISBN:9781439834183 (set) | 1439834180 (set) | 9781439834015 (pbk. : v. 1) | 1439834016 (pbk. : v. 1) | 9781439834022 (pbk. : v. 2) | 1439834024 (pbk. : v. 2) | 9781439834152 (pbk. : v. 3) | 1439834156 (pbk. : v. 3)</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=14617</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1439834180.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Boston, [Mass.] : Nano Science and Technology Institute, 2010 .<br /> 3 v. : , &quot;An interdisciplinary integrative forum on nanotechnology, biotechnology and microtechnology.&quot; | &quot;NSTI Nanotech 2010 Joint Meeting. The 2010 NSTI Nanotechnology Conference and Expo includes: 2010 NSTI Bio Nano Conference and Expo, Bio Nanotech 2010, 2010 Microtechnology Conference and Expo, Microtech 2010, 9th Workshop on Compact Modeling, WCM 2010, NSTI Nanotech Ventures 2010, 2010 TechConnect Summit, Clean Technology 2010.&quot; 28 cm..<br /> 9781439834183 (set) | 1439834180 (set) | 9781439834015 (pbk. : v. 1) | 1439834016 (pbk. : v. 1) | 9781439834022 (pbk. : v. 2) | 1439834024 (pbk. : v. 2) | 9781439834152 (pbk. : v. 3) | 1439834156 (pbk. : v. 3) </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=14617">Place hold on <em>Nanotech Conference &amp; Expo 2010 :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=14617</guid> </item> <item> <title> Microscale and nanoscale heat transfer / </title> <dc:identifier>ISBN:9783540360568 | 3540360565</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=34080</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/3540360565.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Berlin : Springer, 2007 .<br /> 370 p. : 24 cm..<br /> 9783540360568 | 3540360565 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=34080">Place hold on <em>Microscale and nanoscale heat transfer /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=34080</guid> </item> <item> <title> Microjoining and nanojoining / </title> <dc:identifier>ISBN:9781845691790 (Woodhead) | 1845691792 (Woodhead) | 9781420070835 (CRC) | 1420070835 (CRC)</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=59610</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1845691792.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Cambridge, England : | Boca Raton : Woodhead Publishing and Maney Publishing, on behalf of the Institute of Materials, Minerals &amp; Mining ; | CRC Press, 2008 .<br /> xxiv, 810 p. : 24 cm..<br /> 9781845691790 (Woodhead) | 1845691792 (Woodhead) | 9781420070835 (CRC) | 1420070835 (CRC) </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=59610">Place hold on <em>Microjoining and nanojoining /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=59610</guid> </item> <item> <title> Microfabrication and nanomanufacturing / </title> <dc:identifier>ISBN:0824724313 (hbk.)</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=32907</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/0824724313.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Boca Raton, FL : CRC/Taylor &amp; Francis, 2006 .<br /> 401 p. : 27 cm..<br /> 0824724313 (hbk.) </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=32907">Place hold on <em>Microfabrication and nanomanufacturing /</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=32907</guid> </item> <item> <title> Microelectronics to nanoelectronics : materials, devices &amp; manufacturability / </title> <dc:identifier>ISBN:9781466509542</dc:identifier> <link>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=73313</link> <description> <![CDATA[ <img src="https://images-na.ssl-images-amazon.com/images/P/1466509546.01.TZZZZZZZ.jpg" alt="" /> ]]> <![CDATA[ <p> Boca Raton, FL : CRC Press, 2013 .<br /> xxiii, 407 p., [32] p. of plates : 24 cm..<br /> 9781466509542 </p> ]]> <![CDATA[ <p> <a href="https://efind.ump.edu.my/cgi-bin/koha/opac-reserve.pl?biblionumber=73313">Place hold on <em>Microelectronics to nanoelectronics :</em></a> </p> ]]> </description> <guid>https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=73313</guid> </item> </channel> </rss>
