https://efind.ump.edu.my/cgi-bin/koha/opac-search.pl?q=ccl=su%3A%22Multichip%20modules%20Microelectronics%22&sort_by=title_dsc&format=rss 3 0 30 ISBN:158053905x | 9781580539050 https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=53509 ]]> By Gaynor, Michael P..
Boston : Artech House, 2007 .
xiii, 221 p. : 24 cm..
158053905x | 9781580539050

]]> Place hold on System-in-package RF design and applications /

]]> https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=53509 ISBN:9781119045939 https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=87321 ]]> By Li, Suny,.
Hoboken, NJ : Publishing House of Electronics Industry/Wiley, 2017 .
xvii, 477 pages : 25 cm..
9781119045939

]]> Place hold on SiP-system in package design and simulation :

]]> https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=87321 ISBN:0071459065 (alk. paper) | 9780071459068 (alk. paper) https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=47482 ]]> By Tummala, Rao.
New York : McGraw-Hill, 2008 .
xx, 785 p. : 25 cm..
0071459065 (alk. paper) | 9780071459068 (alk. paper)

]]> Place hold on Introduction to system-on-package (SOP) :

]]> https://efind.ump.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=47482