| 000 | 01469nam a2200289 a 4500 | ||
|---|---|---|---|
| 001 | vtls000065531 | ||
| 003 | KUKTEM | ||
| 005 | 20251117141325.0 | ||
| 008 | 121101t2015 si a f 001 0 eng d | ||
| 020 | _a789814327602 (set) | ||
| 020 | _a9789814327633 (v.1) | ||
| 020 | _a9789814327657 (v.2) | ||
| 020 | _a9789814313841 (v.3) | ||
| 020 | _a9789814583435 (v.4) | ||
| 039 | 9 |
_a201512281608 _bsaini _c201506231518 _dazli _y201211011300 _zsri |
|
| 040 | _aUMP | ||
| 245 | 0 | 0 |
_aEncyclopedia of thermal packaging. _nSet 2, _pThermal packaging tools / _ceditor-in-chief Avram Bar-Cohen |
| 246 | 3 | _aThermal packaging tools | |
| 260 |
_aSingapore : _bWorld Scientific , _c2015 |
||
| 300 |
_a4 v. : _bill. ; _c25 cm. |
||
| 504 | _aIncludes bibliographical references and index | ||
| 505 | 0 | _av. 1. Cooling of microelectronic and nanoelectronic equipment : advances and emerging research / Madhusudan Iyengar, Karl J. L. Geisler, Bahgat Sammakia -- v. 2. Energy optimization and thermal management of data centers / Bahgat Sammakia ... [et al.] -- v. 3. Compact thermal models of electronic components / Clemens Lasance, Mohammed-Nabil Sabry -- v. 4. Thermally-informed design of microelectronic components / Ankur Srivastava ... [et al.] | |
| 650 | 0 | _aElectronic packaging | |
| 650 | 0 | _aInsulation (Heat) | |
| 700 | 1 |
_aBar-Cohen, Avram, _d1946- |
|
| 999 |
_aVIRTUA40 _c14892 _d14898 |
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| 999 | _aVTLSSORT0080*0200*0201*0202*0203*0204*0400*0900*2450*2460*2600*3000*5040*5050*6500*6501*7000*9992 | ||