| 000 | 01510nam a2200289 a 4500 | ||
|---|---|---|---|
| 001 | vtls000065530 | ||
| 003 | KUKTEM | ||
| 005 | 20251117141343.0 | ||
| 008 | 121101t2013 si a f e 001 0 eng d | ||
| 020 | _a9789814313780 (set) | ||
| 020 | _a9789814313803 (v. 1) | ||
| 020 | _a9789814313810 (v. 2) | ||
| 020 | _a9789814313827 (v. 3) | ||
| 020 | _a9789814313834 (v. 4) | ||
| 020 | _a9789814327619 (v. 5) | ||
| 020 | _a9789814327626 (v. 6) | ||
| 039 | 9 |
_a201504231531 _bsaini _y201211011252 _zsri |
|
| 040 | _aUMP | ||
| 245 | 0 | 0 |
_aEncyclopedia of thermal packaging. _nSet 1, _pThermal packaging techniques / _ceditor-in-chief Avram Bar-Cohen |
| 260 |
_aSingapore : _bWorld Scientific Pub., _c2013 |
||
| 300 |
_a6 v. : _bill. ; _c25 cm. |
||
| 505 | 0 | _av. 1. Microchannel heat sinks for electronics cooling / Suresh V. Garimella, Tannaz Harirchian -- v. 2. Air- and liquid-cooled cold plates / Allan Kraus -- v. 3. Dielectric liquid cooling of immersed components / Karl J. L. Geisler. Avram Bar-Cohen -- v. 4. Thermoelectric microcoolers / Bao Yang, Peng Wang -- v. 5. Energy efficienct solid state lighting / Mehmet Arik, Anant Setlur, Stanton E. Weaver Jr., Joseph J. Shiang -- v. 6. Experimental thermofluid characterization of electronic components / Gary L. Solbrekken | |
| 650 | 0 | _aElectronic packaging | |
| 650 | 0 | _aInsulation (Heat) | |
| 700 | 1 |
_aBar-Cohen, Avram, _d1946- |
|
| 999 |
_aVIRTUA40 _c15358 _d15364 |
||
| 999 | _aVTLSSORT0080*0200*0201*0202*0203*0204*0205*0206*0400*0900*2450*2600*3000*5050*6500*6501*7000*9992 | ||