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020 _a9781607416753 (electronic bk.)
020 _a1607416751 (electronic bk.)
020 _a9781604564518 (hardcover)
020 _a1604564512 (hardcover)
039 9 _a201107140022
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040 _aUMP
090 _aTK7874.53 .H36 2009
100 1 _aHübner, René
245 1 0 _aAdvanced Ta-based diffusion barriers for Cu interconnects
_h[electronic resource] /
_cRené Hübner
260 _aNew York :
_bNova Science Publishers,
_cc2009
300 _a1 online resource (xvi, 366 p.) :
_bill.
500 _aDescription based on print version record
504 _aIncludes bibliographical references (p. [81]-94) and index
538 _aMode of access: Internet
650 0 _aInterconnects (Integrated circuit technology)
650 0 _aIntegrated circuits
650 0 _aElectrodiffusion
856 4 0 _3NetLibrary
_uhttp://www.netlibrary.com.libraryumpsa.idm.oclc.org/urlapi.asp?action=summary&v=1&bookid=281179
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