000			02156nam a2200265 a 4500
001			vtls000045502
003			KUKTEM
005			20251114204425.0
008			100503t2009 my ao f m 000 0 eng|d
020			_aTHE0006601(Local)
039		9	_a201905161121 _bamirul _c201107132316 _dVLOAD _c201005200957 _dida _y201005031550 _zida
040			_aUMP
090			_aTJ1191.5 .H37 2009 rs Bc.
100	0		_aMuhammad Hasri Ibrahim
245	1	0	_aThermal reponse of silicon during virtual laser micromachining / _cMuhammad Hasri Bin Ibrahim
246	3		_aThermal reponse of silicon during virtual laser micromachining _h[electronic resource]
260			_aKuantan, Pahang : _bUMP, _c2009
300			_axvi, 49 p. : _bill. (some col.) ; _c30 cm. + _e1 computer disc
502			_aProject paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2009
504			_aBibliography : p. 46-47
520	3		_aThis project presents thermal response of silicon during virtual laser micromachining based on finite element method. Predictable models were developed using ALGOR FE code to simulate laser micromachining and to predict temperature distribution in silicon due to laser material interaction. Two FE models, linear and circular cutting were developed. Thermal properties of silicon were taken from literature. Time dependent heat flux was defined at each node along cutting line, laser velocity was designed by model distance and time interval. Transient heat transfer analysis was used to simulate laser micromachining. Process parameters considered were laser power, velocity and plasma gas effect. Total of 28 simulations were done. The FE model was validated from published report. Results qualitatively were found to be agreeable. Crucial factors are found to be pulse energy and moving velocity in reducing thermal cracks and thermal debris. This virtual work can significantly reduce the cost and time for process development in industry, and improve product reliability.
650		0	_aMicromachining
650		0	_aHeat _xTransmission
999			_aVIRTUA40 _c1778 _d1784
999			_aVTLSSORT0080*0200*0400*0900*1000*2450*2460*2600*3000*5020*5040*5200*6500*6501*9992