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003			KUKTEM
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008			100518t2009 my a f m 000 0 engrd
020			_aTHE0007475(Local)
039		9	_a201905161320 _bfawwaz _c201204051142 _dFida _c201107132320 _dVLOAD _c201005180921 _dida _y201005180907 _zida
040			_aUMP
090			_aTP1150 .T64 2009 rs Bc.
100	1		_aToh, Ban Sheng
245	1	0	_aReverse engineering of mobile phone casing and analysis of weld-line defect / _cToh Ban Sheng
260			_aKuantan, Pahang : _bUMP, _c2009
300			_axvi, 54 p. : _bill. ; _c30 cm. + _e1 CD-ROM
502			_aProject paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2009
504			_aBibliography : p. [40]-42
520	3		_aIn recent decades, reverse engineering (RE) has gradually become important when it comes to the situation that a component must be reproduced but its original engineering data are no longer or not accessible. Sophisticated technologies are introduced for the purpose of reverse engineering. The state-of-the-art technology in latest days is the use of 3D laser scanning with aid of reverse-engineering software to create the 3D geometry model of the existing component. The most appropriate way to duplicate the component is by plastic injection moulding. However, defect such as weld lines always occur during injection moulding process which makes the component aesthetically and structurally unacceptable. Therefore, injection moulding simulation on the component is necessary to investigate the variables that affect the formation of weld lines. Simulations are repetitively done to determine the most optimal variables that remove or reduce weld lines to minimum before the component is ready for reproduction.
650		0	_aInjection molding of plastics
650		0	_aPlastics _xMoulding
650		0	_aReverse engineering
999			_aVIRTUA40 _c1807 _d1813
999			_aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5020*5040*5200*6500*6501*6502*9992