000 00925nam a2200253 a 4500
001 vtls000005710
003 KUKTEM
005 20251117142114.0
008 060606t1998 nyua f 000 0 eng d
020 _a0079137121
039 9 _a201207021651
_bida
_c201107131710
_dVLOAD
_c201106070857
_dtraining
_c200908141037
_dVLOAD
_y200606141125
_zVLOAD
040 _aUMP
090 _aTK454 .K54 1998
100 1 _aKielkowski, Ron M.
245 1 0 _aInside SPICE /
_cRon M. Kielkowski
250 _a2nd ed.
260 _aNew Yorkv:
_bMcGraw-Hill,
_c1998
300 _axv, 200 p. :
_bill. ;
_c24 cm. +
_e1 computer disc
440 0 _aElectronic packaging and interconnection series
504 _aIncludes bibliographical references and index
650 0 _aElectric circuits
_xComputer simulation
730 0 2 _aSPICE (Computer file)
999 _aVIRTUA40
_c22535
_d22541
999 _aVTLSSORT0080*0200*0400*0900*1000*2450*2500*2600*3000*4400*5040*6500*7300*9992