000			02075nam a2200265 a 4500
001			vtls000052423
003			KUKTEM
005			20251114204446.0
008			110329t2010 my a f m 000 0 eng d
020			_aTHE0006607(Local)
039		9	_a201905161136 _bamirul _c201110040956 _dFida _c201107140041 _dVLOAD _c201103291041 _dida _y201103291027 _zida
040			_aUMP
090			_aTJ1191.5 .Y66 2010 rs Bc.
100	1		_aYong, Chee Ping
245	1	0	_aFeasible laser parameters in fabrication of MEMS structures on silicon / _cYong Chee Ping
246	3		_aFeasible laser parameters in fabrication of MEMS structures on silicon _h[computer file]
260			_aKuantan, Pahang : _bUMP, _c2010
300			_axvi, 42 p. : _bill. (some col.) ; _c30 cm. + _e1 computer discs
502			_aProject paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2010
504			_aBibliography : p. 40
520	3		_aThe technique of making MEMS structures are kept improving which from old fashion with high cost machine to very advanced one to save time and labor cost. In this report, laser machining of silicon using ND:YAG is introduced. The main objectives are generating MEMS structures on silicon wafer by using laser micromachining and the effects of parameters of laser micromachining on silicon.STATISTICA is used to design and analyze the experiments. Two experimental sets: (1) laser processing with assist gas and (2)laser processing without assist gas were carried out. Basic feature of MEMS and micro spots were generated. The micro features were investigated under SEM. Experimental results were analyzed in STATISTICA. Analyzed results show that laser power is the most significant effect followed by pulse width and the assist gas on the micro feature size and particularly feature quality. It was found that laser processing without assist gas produce promising results.
650		0	_aMicromachining
650		0	_aMicroelectromechanical systems
999			_aVIRTUA40 _c2380 _d2386
999			_aVTLSSORT0080*0200*0400*0900*1000*2450*2460*2600*3000*5020*5040*5200*6500*6501*9992