| 000 | 00957nam a2200229 a 4500 | ||
|---|---|---|---|
| 001 | vtls000039616 | ||
| 003 | KUKTEM | ||
| 005 | 20251114204450.0 | ||
| 008 | 090707t2007 my a f m 001 0 eng|d | ||
| 020 | _aTHE0006900(Local) | ||
| 039 | 9 |
_a201906131018 _baida _c201107132148 _dVLOAD _c200911091806 _dkam _c200908141644 _dVLOAD _y200907071048 _zida84 |
|
| 040 | _aUMP | ||
| 090 | _aTK7868.P7 A75 2007 rs Bc. | ||
| 100 | 0 | _aAriff Syakirin Ghazalli | |
| 245 | 1 | 0 |
_aJoint solder of lead free solder (Sn0.7Cu) and prrinted circuit board with various heat treatment temperatures / _cAriff Syakirin Bin Ghazalli |
| 260 |
_aKuantan, Pahang : _bUMP, _c2007 |
||
| 300 |
_a50 p. : _bill. (some col.) ; _c30 cm. |
||
| 502 | _aProject paper (Bachelor of Mechanical Engineering) -- Universiti Malaysia Pahang - 2007 | ||
| 650 | 0 | _aSolder and soldering | |
| 650 | 0 | _aPrinted circuits | |
| 999 |
_aVIRTUA40 _c2509 _d2515 |
||
| 999 | _aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5020*6500*6501*9992 | ||