000 02768nam a2200241 a 4500
001 vtls000040059
003 KUKTEM
005 20251114204517.0
008 090710t2008 my a f m 000 0 eng d
020 _aTHE0005944(Local)
039 9 _a201905141514
_baida
_c201204091016
_dFida
_c201107132244
_dVLOAD
_c200908141646
_dVLOAD
_y200907101103
_zkam
040 _aUMP
090 _aTA660.F6 A39 2008 rs Bc.
100 0 _aMohd Adzwan Md. Nor
245 1 0 _aOptimization of cooling channel parameters for designing three plate mould of hexagonal floor tile using Taguchi method to reduce warpage /
_cMohd Adzwan Md. Nor
260 _aKuantan, Pahang :
_bUMP,
_c2008
300 _a58 p. :
_bill. (some col.) ;
_c30 cm. +
_e1 CD-ROM
502 _aProject paper (Bachelor of Mechanical Engineering with Manufacturing Engineering) -- Universiti Malaysia Pahang - 2008
520 _aThis project deals with optimization of cooling channel parameters for designing three plate mould of hexagonal floor tile using Taguchi method to reduce warpage. The objective of this project is to analyze the hexagonal floor tile design by simulation with Moldflow Plastic Insight software (MPI) and to optimize the mould design parameter using Taguchi method. The product is designed in hexagonal shape build with interlocking features and will be used for application in indoor sports activities such as futsal, badminton, takraw and other sports. The material used for this design is thermoplastic elastomer (TPE) that increased the slipping resistance due to active and fast movement on it. The design of the product will be analyzed using MoldFlow Plastic Insight software (MPI) to reduce the warpage problem that appears during injecting the product. Warpage is the deflection of the part on the product design from its original shape. Taguchi method is used to optimize the parameter of the mould design for injecting the product with less warpage. In addition, the signal to noise ratio and analysis of variance is utilized to optimize the parameter for the product. The Taguchi method is conducted to minimize the warpage in both +z deflection and -z deflection. The result shown that, the most significance parameter of the mold design that tend to minimized the warpage values are from the cooling channel diameter at cavity half, cooling channel distance at core half and cooling channel diameter at core half. Also, from the result the summarized of the mold design parameter that reduces the warpage problem has been identified for the further process which is fabrication of mold.
650 0 _aFlooring, Tile
_xDesign and construction
650 0 _aTaguchi methods (Quality control)
999 _aVIRTUA40
_c3279
_d3285
999 _aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5020*5200*6500*6501*9992