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005 20251117144502.0
008 080130t2004 my f 101 0 eng|d
020 _a983251486X
039 9 _a201107131951
_bVLOAD
_c200908141405
_dVLOAD
_c200908141337
_dVLOAD
_c200908131732
_dVLOAD
_y200801301534
_zkam
040 _aUMP
090 _aTK7871 .E44 2004
111 2 _aEMAP
_n(6th :
_d2004 :
_cPenang, Malaysia)
245 1 0 _aProceeding of the 6th International Conference on Electronic Materials and Packaging (EMAP 2004), December 5-7, 2006 Penang, Malaysia
260 _aPenang, Malaysia :
_bIEEE CPMT,
_c2004
300 _a631 p. :
_bill. ;
_c30 cm.
650 0 _aElectronics
_xMaterials
999 _aVIRTUA40
_c37276
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999 _aVTLSSORT0080*0200*0400*0900*1110*2450*2600*3000*6500*9991