| 000 | 01083nam a2200301 a 4500 | ||
|---|---|---|---|
| 001 | vtls000056160 | ||
| 003 | KUKTEM | ||
| 005 | 20251117144511.0 | ||
| 008 | 111121t2010 nyua f 001 0 eng d | ||
| 020 | _a9780071476232 | ||
| 020 | _a0071476237 | ||
| 020 | _a9780071701013 (hbk.) | ||
| 020 | _a007170101X (hbk.) | ||
| 039 | 9 |
_a201202161529 _basmadi _c201111211138 _dsri _c201111211135 _dsri _y201111211132 _zsri |
|
| 040 | _aUMP | ||
| 090 | _aTK7836 .H37 2010 | ||
| 100 | 1 | _aHarman, George G. | |
| 245 | 1 | 0 |
_aWire bonding in microelectronics / _cGeorge G. Harmon |
| 250 | _a3rd ed. | ||
| 260 |
_aNew York : _bMcGraw-Hill, _c2010 |
||
| 300 |
_axx, 426 p. : _bill. ; _c24 cm. + _e1 CD-ROM |
||
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aWire bonding (Electronic packaging) _xProduction control |
|
| 650 | 0 |
_aElectronic packaging _xReliability |
|
| 650 | 0 |
_aElectronic packaging _xDefects |
|
| 650 | 0 |
_aSemiconductors _xFailures |
|
| 999 |
_aVIRTUA40 _c37594 _d37600 |
||
| 999 | _aVTLSSORT0080*0200*0201*0202*0203*0400*0900*1000*2450*2500*2600*3000*5040*6500*6501*6502*6503*9991 | ||