| 000 | 00950nam a2200253 a 4500 | ||
|---|---|---|---|
| 001 | vtls000024624 | ||
| 003 | KUKTEM | ||
| 005 | 20251117144517.0 | ||
| 008 | 080222t2005 xxk g 001 0 eng d | ||
| 020 | _a0815515138 | ||
| 039 | 9 |
_a201107131956 _bVLOAD _c201103161118 _dFida _c200908141411 _dVLOAD _c200908141343 _dVLOAD _y200802221738 _zharyati |
|
| 040 | _cUMP | ||
| 090 | _aTK871 .L53 2005 | ||
| 100 | 1 | _aLicari, James J., 1930- | |
| 245 | 1 | 0 |
_aAdhesive technology for electronic applications : _bmaterials, processes, reliability / _cJames J. Licari and Dale W. Swanson |
| 260 |
_aNorwich : _bWilliam Andrew Pub., _c2005 |
||
| 300 |
_a459 p. ; _c23 cm. |
||
| 500 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aElectronics _xMaterials |
|
| 650 | 0 | _aAdhesives | |
| 650 | 0 | _aElectronic packaging | |
| 700 | 1 | _aSwanson, Dale W. | |
| 999 |
_aVIRTUA40 _c37776 _d37782 |
||
| 999 | _aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5000*6500*6501*6502*7000*9991 | ||