000			02055ntm a2200241 a 4500
001			vtls000082923
003			KUKTEM
005			20251114204535.0
008			141104s2013 my da f m 000 0 eng|d
020			_aTHE0007735(Local)
039		9	_a201905241057 _bfawwaz _y201411041037 _ztraining2
040			_aUMP
090			_aTS590 .Z85 2013 r Bc.
100	1		_aZulfadly Syazwan Zolkhair
245	1	0	_aDifferent coating type on copper substrate / _cZulfadly Syazwan Zolkhair
260			_aKuantan, Pahang : _bUMP, _c2013
300			_axiii, 39 p. : _bill. (some col.) ; _c30 cm. + _e1 CD-ROM
502			_aProject Paper (Bachelor of Mechanical Engineering (Automotive)) -- Universiti Malaysia Pahang – 2013
504			_aBibliography : p. [40-43]
520			_aThis thesis will deal with the effect of different coating types on solder joint strength, specifically on intermetallic compound (IMC). Coating is essential in printed circuit board application since it can protect the base material, which is Copper, from oxidation and degradation. However, the coating thickness will give different effect on solder jointstrength or life. Two types of surface finish have been used in this research which isElectroless Nickel and Electroless Nickel / Immersion Gold (ENIG). The purposes of thesurface finish are to provide a diffusion barrier, oxidation barrier, adhesion and solderablesurface on copper substrate. For this research, solder material that will be used is Sn-4Ag0.5Cu to form a solder joint. All samples were subjected to reflow soldering and then to the isothermal ageing at 150℃ with duration 250 hours and 500 hours. The IMCs werecharacterized using scanning electron microscopy and image analyser to investigate the thickness of IMC on solder joint at all samples. From the research, it was observed that the IMC growth is influenced by ageing duration where the thickness of IMC is increases with ageing.
650		0	_aMetal Manufactures
999			_aVIRTUA40 _c3817 _d3823
999			_aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5020*5040*5200*6500*9992