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|---|---|---|---|
| 001 | vtls000034203 | ||
| 003 | KUKTEM | ||
| 005 | 20251117145509.0 | ||
| 008 | 090128t2008 nyua f b 001 0 eng d | ||
| 020 | _a0071459065 (alk. paper) | ||
| 020 | _a9780071459068 (alk. paper) | ||
| 039 | 9 |
_a201107132202 _bVLOAD _c200908141654 _dVLOAD _c200908141637 _dVLOAD _c200908132133 _dVLOAD _y200901281427 _zshah |
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| 040 | _aUMP | ||
| 090 | _aTK7870.15 .T86 2008 | ||
| 100 | 1 | _aTummala, Rao | |
| 245 | 1 | 0 |
_aIntroduction to system-on-package (SOP) : _bminiaturization of the entire system / _cRao R. Tummala, Madhavan Swaminathan |
| 260 |
_aNew York : _bMcGraw-Hill, _cc2008 |
||
| 300 |
_axx, 785 p. : _bill. ; _c25 cm. |
||
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aMultichip modules (Microelectronics) _xDesign and construction |
|
| 650 | 0 | _aMicroelectronic packaging | |
| 700 | 1 | _aSwaminathan, Madhavan | |
| 999 |
_aVIRTUA40 _c47482 _d47488 |
||
| 999 | _aVTLSSORT0080*0200*0201*0400*0900*1000*2450*2600*3000*5040*6500*6501*7000*9991 | ||