000 02421nam a2200241 a 4500
001 vtls000081888
003 KUKTEM
005 20251117113226.0
008 141009t2013 my a f m 000 0 eng d
020 _aTHE0006899(Local)
039 9 _a201906131017
_baida
_c201411051137
_dsafura
_y201410091026
_zFida
040 _aUMP
090 _aTK7868.P7 A45 2013 r Bc.
100 0 _aMuhammad Aminuddin Adnan
245 1 0 _aEffect of corrosion on printed circuit board /
_cMuhammad Aminuddin Adnan
260 _aKuantan, Pahang :
_bUMP,
_c2013
300 _axiii, 54 p. :
_bill. (some col.) ;
_c30 cm. +
_e1 CD-ROM
502 _aProject paper (Bachelor of Mechanical Engineering (Automotive Engineering)) -- Universiti Malaysia Pahang - 2013
504 _aBibliography : p.[55-57]
520 3 _aCorrosion of electronic systems has been a significant issue in electronic industry nowadays. One of the most common corrosion type is the atmospheric corrosion. Therefore, even a small environmental impact can cause huge damages if the components are not well protected. When the device is in use, the large voltage gradients between points on a printed circuit board (PCBs) will accelerate the corrosion problems dramatically. The complexity of the atmosphere, as corrosion environment, results from atmosphere composition and from presence of some factors as pollutants, temperature, humidity, wind speed and direction. So, the objective of the study is to identify the effect of corrosion on solder joint and copper substrate in 0.5M Sulphuric acid (H2S0) in order to determine the corrosion rate of the substrate in duration time by using weight loss measurement method. Lead-free solder bump were used to form solder joint between lead-free solder Sn-3Ag-0.5Cu (SAC 305) solders with the plated copper substrate. The copper substrate surface finish was deposited by the electroless nickel. The result of study shows the corrosion on the substrate after immersed in 0.5M Sulphuric acid at 168 hours, 336 hours, and 504 hours. The effect of corrosion was increased with the time duration increased. The weight loss data indicated that the thickness of the substrate decreased with the time duration. The structure of the solder joint was analyze using scanning electron microscopy (SEM).
650 0 _aPrinted circuits
999 _aVIRTUA40
_c5011
_d5017
999 _aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*5020*5040*5200*6500*9992