000 01188nam a2200301 a 4500
001 vtls000046805
003 KUKTEM
005 20251117150236.0
008 100701t2007 flua f b 001 0 eng d
020 _a9780849335570 (alk. paper)
020 _a0849335574 (alk. paper)
020 _a1420018965
020 _a9781420018967
039 9 _a201107132354
_bVLOAD
_c201010291638
_dfauzi
_y201007011524
_zshikin
040 _aUMP
090 _aTK7871.15.C4 C44 2007
245 0 0 _aCeramic interconnect technology handbook /
_cedited by Fred D. Barlow III, Aicha Elshabini
260 _aBoca Raton :
_bCRC Press/Taylor & Francis,
_cc2007
300 _a441 p. :
_bill. ;
_c25 cm.
504 _aIncludes bibliographical references and index
650 0 _aElectronic ceramics
650 0 _aElectronic packaging
_xMaterials
650 0 _aInterconnects (Integrated circuit technology)
_xDesign and construction
700 1 _aBarlow, Fred D.
700 1 _aElshabini, Aicha
856 4 1 _3Table of contents only
_uhttp://www.loc.gov/catdir/toc/ecip0618/2006024037.html
999 _aVIRTUA40
_c54351
_d54357
999 _aVTLSSORT0080*0200*0201*0202*0203*0400*0900*2450*2600*3000*5040*6500*6501*6502*7000*7001*8560*9991