| 000 | 00990nam a2200289 a 4500 | ||
|---|---|---|---|
| 001 | vtls000048673 | ||
| 003 | KUKTEM | ||
| 005 | 20251117150255.0 | ||
| 008 | 101201t2010 nyua f 001 0 eng d | ||
| 020 | _a9780387887821 | ||
| 020 | _a0387887822 | ||
| 039 | 9 |
_a201107211554 _basmadi _c201107140001 _dVLOAD _y201012011112 _ztraining |
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| 040 | _aUMP | ||
| 090 | _aTK7870.15 .L59 2009 | ||
| 100 | 1 | _aLi, Yi | |
| 245 | 1 | 0 |
_aElectrical conductive adhesives with nanotechnologies / _cYi Li, Daniel Lu, C. P. Wong |
| 260 |
_aNew York, NY : _bSpringer, _c2009 |
||
| 300 |
_axii, 437 p. : _bill. ; 24 cm. |
||
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 | _aElectronic packaging | |
| 650 | 0 | _aSolder and solder | |
| 650 | 0 |
_aAdhesives _xElectric properties |
|
| 650 | 0 | _aNanostructured materials | |
| 700 | 1 | _aLu, Daniel | |
| 700 | 1 | _aWong, C. P. | |
| 999 |
_aVIRTUA40 _c54993 _d54999 |
||
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