000 02626nam a2200277 a 4500
001 vtls000043314
003 KUKTEM
005 20251117150433.0
008 090904t2009 si a f b 001 0 eng d
020 _a9780470824078
020 _a0470824077
039 9 _a201107131919
_bVLOAD
_c201011081233
_djamie
_y200909041026
_znadia
040 _aUMP
090 _aTK7871.99.M44 K47 2009
100 1 _aKer, Ming-Dou.
245 1 0 _aTransient-induced latchup in CMOS integrated circuits /
_cMing-Dou Ker and Sheng-Fu Hsu
260 _aSingapore ;
_aHoboken, NJ :
_bWiley ;
_a[Piscataway, NJ] :
_bIEEE Press,
_cc2009
300 _axiii, 249 p. :
_bill. ;
_c26 cm.
504 _aIncludes bibliographical references and index
505 0 _aPhysical Mechanism of TLU under the System-Level ESD Test -- Component-Level Measurement for TLU under System-Level ESD Considerations -- TLU Dependency on Power-Pin Damping Frequency and Damping Factor in CMOS Integrated Circuits -- TLU in CMOS ICs in the Electrical Fast Transient Test -- Methodology on Extracting Compact Layout Rules for Latchup Prevention -- Special Layout Issues for Latchup Prevention -- TLU Prevention in Power-Rail ESD Clamp Circuits -- Appendix A: Practical Application Extractions of Latchup Design Rules in a 0.18-mm 1.8 V/3.3V Silicided CMOS Process
520 _a"Transient-Induced Latchup in CMOS Integrated Circuits equips the practicing engineer with all the tools needed to address this regularly occurring problem while becoming more proficient at IC layout. Ker and Hsu introduce the phenomenon and basic physical mechanism of latchup, explaining the critical issues that have resurfaced for CMOS technologies. Once readers can gain an understanding of the standard practices for TLU, Ker and Hsu discuss the physical mechanism of TLU under a system-level ESD test, while introducing an efficient component-level TLU measurement setup. The authors then present experimental methodologies to extract safe and area-efficient compact layout rules for latchup prevention, including layout rules for I/O cells, internal circuits, and between I/O and internal circuits. The book concludes with an appendix giving a practical example of extracting layout rules and guidelines for latchup prevention in a 0.18-micrometer 1.8V/3.3V silicided CMOS process." -- Publisher’s description
650 0 _aMetal oxide semiconductors, Complementary
_xDefects
650 0 _aMetal oxide semiconductors, Complementary
_xReliability
700 1 _aHsu, Sheng-Fu.
999 _aVIRTUA40
_c58341
_d58347
999 _aVTLSSORT0080*0200*0201*0400*0900*1000*2450*2600*3000*5040*5050*5200*6500*6501*7000*9991