| 000 | 00859nam a2200241 a 4500 | ||
|---|---|---|---|
| 001 | vtls000056135 | ||
| 003 | KUKTEM | ||
| 005 | 20251117150515.0 | ||
| 008 | 111118t2011 si a f 001 0 eng d | ||
| 020 | _a9780470827802 | ||
| 020 | _a0470827807 | ||
| 039 | 9 |
_a201201131634 _basmadi _y201111181652 _zsri |
|
| 040 | _aUMP | ||
| 090 | _aTK7870.15 .L58 2011 | ||
| 100 | 1 | _aLiu, Sheng | |
| 245 | 1 | 0 |
_aModeling and simulation for microelectronic packaging assembly : _bmanufacture, reliability, and testing / _cSheng Liu, Yong Liu |
| 260 |
_aSingapore : _bWiley, _c2011 |
||
| 300 |
_axxii, 564 p. : _bill. ; _c26 cm. |
||
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aMicroelectronic packaging _xSimulation methods |
|
| 700 | 1 | _aLiu, Yong | |
| 999 |
_aVIRTUA40 _c59728 _d59734 |
||
| 999 | _aVTLSSORT0080*0200*0201*0400*0900*1000*2450*2600*3000*5040*6500*7000*9991 | ||