000			01874nam a2200349 a 4500
001			vtls000060015
003			KUKTEM
005			20251125093249.0
008			120522t2004 paua f b 101 0 eng d
020			_a9781558997578
020			_a1558997571
039		9	_a201710021127 _bAUTHORITY _c201212031254 _dfauzi _c201212031123 _dfauzi _y201205221510 _zsafura
040			_aUMP
090			_aTK7871.85 .A38 2004
111	2		_aAdvanced Metallization Conference
245	1	0	_aAdvanced Metallization Conference 2003 (AMC 2003) : _bproceedings of the conference held October 21-23, 2003, in Montreal, Canada, and September 29-October 1, 2003 University of Tokyo, Tokyo, Japan. This Conference is MRS affiliated and sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, California, U.S.A. / _ceditors, Gary W. Ray ... [et al]
246	3	0	_aAMC 2003
260			_aWarrendale, Pa. : _bMaterials Research Society, _cc2004
300			_axxiii, 792 p. : _bill. ; _c24 cm.
490	1		_aMaterials Research Society conference proceedings _x1048-0854
504			_aIncludes bibliographical references and indexes
650		0	_aSemiconductors _xDesign and construction _vCongresses
650		0	_aIntegrated circuits _xUltra large scale integration _xMaterials _vCongresses
650		0	_aIntegrated circuits _xUltra large scale integration _xDesign and construction _vCongresses
650		0	_aThin films _vCongresses
650		0	_aMetallic films _vCongresses
650		0	_aMetallizing _vCongresses
700	1		_aRay, Gary W.
710	2		_aUniversity of California, Berkeley. _bContinuing Education in Engineering
830		0	_aMaterials Research Society conference proceedings _x1048-0854
999			_aVIRTUA40 _c63023 _d63029
999			_aVTLSSORT0080*0200*0201*0400*0900*1110*2450*2460*2600*3000*4900*5040*6500*6501*6502*6503*6504*6505*7000*7100*8300*9992