| 000 | 01095nam a2200277 a 4500 | ||
|---|---|---|---|
| 001 | vtls000066867 | ||
| 003 | KUKTEM | ||
| 005 | 20251125093324.0 | ||
| 008 | 121126t2011 ne a f b 001 0 eng d | ||
| 020 | _a9781437778892 | ||
| 039 | 9 |
_a201306171216 _bjamie _c201306171215 _djamie _c201306171214 _djamie _y201211261436 _zfarina |
|
| 040 | _aUMP | ||
| 090 | _aTK7871 .L53 2011 | ||
| 100 | 1 | _aLicari, James J. | |
| 245 | 1 | 0 |
_aAdhesives technology for electronic applications : _bmaterials, processing, reliability / _cJames J. Licari and Dale W. Swanson |
| 260 | _a2nd ed. | ||
| 300 |
_aAmsterdam, Netherlands : _bWilliam Andrew Pub., _cc2011 |
||
| 490 | 1 | _aMaterials and processes for electronic applications series | |
| 504 | _aIncludes bibliographical references and index | ||
| 650 | 0 |
_aElectronics _xMaterials |
|
| 650 | 0 | _aAdhesives | |
| 650 | 0 | _aElectronic packaging | |
| 700 | 1 | _aSwanson, Dale W. | |
| 830 | 0 | _aMaterials and processes for electronic applications series | |
| 999 |
_aVIRTUA40 _c63606 _d63612 |
||
| 999 | _aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*4900*5040*6500*6501*6502*7000*8300*9992 | ||