| 000 | 01696nam a2200325 a 4500 | ||
|---|---|---|---|
| 001 | vtls000059950 | ||
| 003 | KUKTEM | ||
| 005 | 20251125093351.0 | ||
| 008 | 120522t1996 paua f b 001 0 eng d | ||
| 020 | _a9781558993419 | ||
| 020 | _a155899341X | ||
| 039 | 9 |
_a201212051647 _bFida _c201211301149 _dfauzi _c201205221103 _dsafura _y201205221103 _zsafura |
|
| 040 | _aUMP | ||
| 090 | _aTK7874.76 .A38 1996 | ||
| 245 | 0 | 0 |
_aAdvanced metallization and interconnect systems for ULSI applications in 1995 : _bproceedings of the conference held October 3-5, 1995 in Portland, Oregon, sponsored by Continuing Education in Engineering, University Extension, University of California at Berkeley, U.S.A., a parallel session of the conference was held from October 24- 25, 1995 in Tokyo, Japan / _ceditors, Russell C. Ellwanger, Shi-Qing Wang |
| 260 |
_aPittsburgh, Pa. : _bMaterials Research Society, _cc1996 |
||
| 300 |
_axix, 767 p. : _bill. ; _c24 cm. |
||
| 490 | 1 |
_aConference proceedings, _x1048-0854 |
|
| 504 | _aIncludes bibliographical references and indexes | ||
| 650 | 0 |
_aIntegrated circuits _xUltra large scale integration _xDesign and construction _vCongresses |
|
| 650 | 0 |
_aVapor-plating _vCongresses |
|
| 650 | 0 |
_aElectrochemical metallizing _vCongresses |
|
| 650 | 0 |
_aDielectrics _vCongresses |
|
| 650 | 0 |
_aTitanium nitride _vCongresses |
|
| 700 | 1 | _aEllwanger, Russell C. | |
| 700 | 1 | _aWang, Shi-Qing | |
| 710 | 2 |
_aUniversity of California, Berkeley. _bContinuing Education in Engineering |
|
| 830 | 0 | _aMaterials Research Society conference proceedings | |
| 999 |
_aVIRTUA40 _c64054 _d64060 |
||
| 999 | _aVTLSSORT0080*0200*0201*0400*0900*2450*2600*3000*4900*5040*6500*6501*6502*6503*6504*7000*7001*7100*8300*9992 | ||