| 000 | 00863nam a2200217 a 4500 | ||
|---|---|---|---|
| 001 | vtls000065921 | ||
| 003 | KUKTEM | ||
| 005 | 20251125093423.0 | ||
| 008 | 121109t2012 njua f 001 0 eng d | ||
| 020 | _a9780470623466 (hardback) | ||
| 039 | 9 |
_a201307191026 _bsaini _y201211091053 _znadia |
|
| 040 | _aUMP | ||
| 090 | _aTK7874.893 .L54 2012 | ||
| 100 | 1 | _aLi, Er-Ping | |
| 245 | 1 | 0 |
_aElectrical modeling and design for 3D integration : _b3D integrated circuits and packaging signal integrity, power integrity, and EMC / _cEr-Ping Li |
| 260 |
_aHoboken, NJ : _bJohn Wiley & Sons, _c2012 |
||
| 300 |
_axiv, 366 p. : _bill. ; _c25 cm. |
||
| 650 | 0 | _aThree-dimensional integrated circuits | |
| 650 | 7 |
_aTECHNOLOGY & ENGINEERING / Electronics / Circuits / VLSI & ULSI. _2bisacsh |
|
| 999 |
_aVIRTUA40 _c64577 _d64583 |
||
| 999 | _aVTLSSORT0080*0200*0400*0900*1000*2450*2600*3000*6500*6501*9992 | ||