000			01669nam a2200301 a 4500
001			vtls000061849
003			KUKTEM
005			20251125093556.0
008			120613t2012 enka f 001 0 eng d
020			_a9781107003781 (hardback)
039		9	_a201304041615 _bsaini _y201206131230 _zsafura
040			_aUMP
090			_aTK7876 .L37 2012
245	0	0	_aLCP for microwave packages and modules / _cedited by Anh-Vu H. Pham, Morgan J. Chen, Kunia Aihara
260			_aCambridge : _bCambridge University Press, _c2012
300			_axiv, 253 p. : _bill. ; _c26 cm.
490	0		_aThe Cambridge RF and microwave engineering series
504			_aIncludes bibliographical references and index
505	8		_aMachine generated contents note: 1. Introduction; 2. Characteristics of liquid crystal polymer (LCP) Morgan J. Chen, Kunia Aihara, Cheng Chen and Anh-Vu H. Pham; 3. Fabrication techniques for processing LCP laminates; 4. LCP for wafer level chip scale MEMS; 5. LCP for surface mount interconnects, packages, and modules; 6. LCP for passive components Hai Ta, Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 7. LCP for system design Morgan J. Chen, Kunia Aihara, Andy C. Chen, Jia-Chi Samual Chieh and Anh-Vu H. Pham; 8. LCP reliability
650		0	_aMicrowave devices _xMaterials
650		0	_aMicroelectronic packaging _xMaterials
650		0	_aLiquid crystal devices
650		0	_aPolymer liquid crystals
700	1		_aPham, Anh-Vu H.
700	1		_aChen, Morgan J.
700	1		_aAihara, Kunia
999			_aVIRTUA40 _c66009 _d66015
999			_aVTLSSORT0080*0200*0400*0900*2450*2600*3000*4900*5040*5050*6500*6501*6502*6503*7000*7001*7002*9992